Product Type: Backplane; Number of Slots: 5; Rack Height: 3 U; Backplane Type: VPX Full-mesh;The power density of many VPX systems today precludes use of standard conduction-cooled cards. 8 in. PSC-6236 Product Datasheet. New mobile-class OpenVPX products augment Mercury's server-class and GPGPU building blocks providing latest processor technologies for embedded real-time applicationsMechanical Specifications for Microcomputers Using REDI Conduction Cooling Applied to VITA VPX: This standard defines the mechanical requirements that are needed to ensure the mechanical interchangeability of conduction cooled 3U and 6U Plug-In Modules and defines the features required to achieve Two Level Maintenance compatibility. 2 struggles to dissipate the attendant heat using straight conduction cooling. 3 V. VX3060-S2 Rugged Conduction cooled version is a Plug-in unit according to VITA 48. Available for use in either AC or DC systems, they are 6U high by 5HP (1-inch) wide modules with guide blocks, for use in VPX systems. The patented Isothermal Card Edge ICE-Lok ® is designed to enhance thermal performance for conduction-cooled embedded computing systems. The XPedite2570 is a high-performance, reconfigurable, conduction- or air-cooled, 3U VPX, FPGA processing module based on the Xilinx Kintex® UltraScale™ family of FPGAs. 0 in. High performance 3U or 6U single board computers feature air or conduction-cooled options. VPX-TF3090 3U VPX conduction cooled test frame with tBP-VPX3000. 2-2020: Mechanical Specification for Microcomputers Using REDI Conduction Cooling Applied to VPX. Air-cooled models include an additional 10/100/1000Base-T port available on the front panel RJ45 connector. Development chassis for VPX and SOSA aligned module payloads. The 3U VPX to PCIe Adapter acts as a PCIe switch, providing an electrically and mechanically optimized interface between PCIe boards and VPX systems. • Air cooled (5332) and conduction cooled (5333) configurations with optional conformal coating and extended temperature operation • 5332 Supports 1 drive in 4HP slot with no REDI coversTR E5x/msd -RCx is a rugged conduction cooled 3U VPX™ board optimized for Size, Weight and Power (SWaP). This extensive line includes conduction cooled VPX, air cooled VPX, as well as VPX ATR configurations. or 1. This. pitch conduction-cooled CompactPCI modules. Rugged 3U VPX graphics & GPGPU card based on the NVIDIA Turing architecture using the NVIDIA Quadro RTX 5000 GPU with single-link DVI and DisplayPort™++ outputs. The XPand1201 is a low-cost, flexible, development platform. ca. Expansion Plane. Rugged Conduction Cooled Assemblies and Modules. Available for use in either AC or DC systems, they are 6U high by 5HP (1-inch) wide modules with guide blocks, for use in VPX systems. Operating Temperature Range Storage Temperature Range; Min Max Min Max; AC1: Air Cooled Industrial-40°C +70°C-55°C +100°C: CC1: Conduction Cooled Industrial-40°C +70°C-55°C +100°C: Operating Humidity Range: Up to 95% (non-condensing) EMC: FCC 47CFR Part 2FPGA, 19 Zoll, Nvidia Jetson, CPCI, VPX air cooled, VPX conduction cooled, MicroTCA, Ip-Core, and NVME SSD Locations Primary Industriestraße 10. It can operate up to 85 °C card edge temperature according to VITA 47 Product Features. 0. XIt1083. Built with aero-grade aluminum, the chassis are suitable for rugged onboard/mobile applications and can operate under extreme temperatures, dust and humidity. 2 and stretch the limits at the. This Model Can be used to design the VITA Card Chassis. 3U VPX carrier card. 2 for conduction cooling • VITA 46 board connectors • IEEE 1101. Contact factory for appropriate board configuration based on environmental requirements. The ANSI Standard ANSI/VITA 48. This rugged chip-down VPX card brings the power of NVIDIA and CUDA without a. 3U Switch. The XChange3001 is a 3U VPX-REDI carrier module supporting a single-width XMC card. Works With: Subracks; Cases. Depending on local conditions, packaging and freight charges might not be included. • VITA 46 3U VPX available in conduction cooled -40-+85C environments as well as harsh vibration profiles DESCRIPTION FEATURES & BENEFITS 3U 10G VPX ETHERNET SWITCH AMPHENOL FAMILY OF RUGGEDIZED ETHERNET SWITCHES AAO Part Number Cooling Method Backplane Top AAO RTM Part Number AAO RTM Part. The XPand1004 system is a low-cost development platform for conduction-cooled 3U VPX cards. 8 in. Air flow from bottom to top (Other options available on request) Standard 3U rear transition module. 1/2 ATR, conduction-convection cooled. 3U VPX 40G Ethernet Switch | Layer 2 Switching Conduction-cooled 3U VPX Ethernet switch module. Specification Ordering Information Related Products Resources Summary The ADC-VPX3-XMC is a single XMC carrier for VPX based systems. Spare Power Supplies for W-IE-NE-R NIM and CAMAC chassis, providing high power density and low ripple and noise. VPX hold up power supply is a type of power supply used in high-performance computing applications. Cisco ESR6300 with two routed, four switched Gigabit Ethernet interfaces. MicroTCA CompactPCI /-Serial PXI and PXI Express VME and VME64x VPX Systems Hardware Platform Management Components -. Its short and efficient thermal conductivity path provides for robust cooling performance and maximum power dissipation. Conduction-Cooled 3U VPX-REDI XMC Carrier Card. OpenVPX is the architecture framework that defines system level VPX interoperability for multi-vendor, multi-module, integrated system environments. 1x 100GBase-KR4, 1x 10/25GBase-KR. Downloads. VITA 48. The heat from the internal conduction-cooled. The XChange3031 delivers full wire-speed across all of its ports and supports jumbo frames up to 10 kB. The new cooling standard defines design requirements for platforms that need high performance processing, graphics. Talk to a Hartmann representative today about compliance and your power needs. Hover over a product and select Compare to add to comparison set. 3U VPX boards, and utilizes RTMs to simplify I/O access and support rapid system prototyping. 0, 2. The board supports tunable bandwidths from 200 kHz to 56 MHz over a frequency range from 70 MHz to 6 GHz. 2 Conduction. Just like the NI Ettus Research USRP E320, the VPX3-E320 features a flexible 2 x 2 MIMO RF Agile Transceiver with 12-bit ADC and DACs. Up to 20 CFM of airflow is provided per slot. Up to 32GB DDR4 ECC RAM. 1 compliant cPCI, 2 through 8 slots, 32 bit or 64 bit configurations, +5VIO or +3. Capacities currently up to 20 TB. XPand6902. It provides 550 W of total simultaneous power, which can be distributed as up to 50 A on 12 V, up to 50 A on 5 V, and up to 80 A on 3. The XChange3031 delivers full wire-speed across all of its ports and supports jumbo frames up to 10 kB. 0. 0 in. U-Blox), or secure SAASM M-Code GPS receiver. LOWER RISK. While air and conduction cooling are often implemented to address cooling challenges, liquid cooling solutions can be effective for designs at the chassis,. 0 inch pitch. It provides an easy way to integrate switched mezzanine cards into modern VPX backplanes. 84 W Weight Conduction cooled: 535. Hartmann’s VPX Power Supplies are built for the most rugged applications with quality and reliability in mind. 3U VPX Form Factor, 1” Pitch (conduction cooled) 4, or 8 Lane (factory configured) PCI Express 3. 0 in. wedgelocks are utilized to secure conduction-cooled pcb modules in deployed system level, embedded electronics enclosures. The SX-150 is available in the VITA 48. ANSI/VITA Stabilized Maintenance. 2) where keying as defined in the VME64 Extensions standard cannot be applied. Depending on your processing requirements, XPand3200 Series systems can be populated with high-performance, low-power 3U VPX or 3U cPCI modules designed and manufactured by X-ES. 3U VPX boards and utilizes RTMs to simplify I/O access and support rapid system prototyping. Single Slot 3U VPX Board Features • Largest available capacity in a single 3U VPX slot with dual SATA drives o Compliant with OpenVPXTM (VITA 65). The test adapter is used for measurement and testing of test specimen boards, which gives optimal access of signals, address lines as well as power from backplane assembly. The D575. 8 standard looks to reduce the dependence on conduction cooling for 3U and 6U circuit cards with VPX connectors. View product Compare. 4. 8-2017, “Mechanical Standard for Electronic VPX Plug-in Modules Using Air Flow Through Cooling” was developed and promoted by a working group sponsored by Lockheed Martin,. Nerve conduction studies (NCS) are tests used to evaluate the function of the peripheral nerves. A hybrid switch with 24 ports 32 lane PCI Express Gen 1 / Gen 2 and additional 9 port Gigabit Ethernet switching capabilities provides for highest bandwidth. Compatible with Dawn’s HLD-6262 Holdup Module. 9"L x 5. 1) modules. or 1. 35mm X 160mm] for circuit Boards & plug-in units with AIR or Conduction cool mechanism The base Mechanical specifications of PCB & Plug-In units are defined by VITA46 The Allowable Standoff Height for PMC/XMC is 10mm where 0. The 53xxx Series mounts one XMC module on a 3U VPX carrier with a flexible crossbar switch. VX3060-S2 Rugged Conduction cooled version is a Plug-in unit according to VITA 48. Our Card and Software Packages are Designed for Fast, Portable Integrations. Products includes conduction cooled, air over conduction cooled and liquid cooled solutions for applications requiring 1-slot to 18-slots. Combine various standard components to create a Wedge Lok that satisfies your requirements. Kontron's selection of VPX switches includes fully managed 10 Gigabit Ethernet switching and up to 28 ports Gigabit Ethernet switching. GHz wideband converter is a SOSA-aligned, conduction cooled, VPX RF Payload Card, which provides one channel up, one channel down, and a synthesizer in a single, 3U slice. slots support conduction-cooled 3U VPX, 3U cPCI, or power supply modules. 0 in. It provides one XMC/PMC site, alternately used as a PCIbus 32-bit/66 MHz or as an XMC site with either a x4 or a. or 1. It features dual 9 slot backplanes including PSU slots. The SP306R-VPX StorePak™ is a removable single slot air-cooled 3U VPX storage module designed to be used either in conjunction with Critical I/O’s StoreEngine storage manager, or as a stand-alone Direct Attach Storage device. Heat generated inside the chassis by the electronics flows into the chassis aluminum sidewalls and down into the cold plate. Bringing the NI Ettus Research USRP E320 to the VPX form factor, the VPX3-E320 is a ruggedized, user-programmable software-defined radio, ideal for low-to-medium bandwidth RF applications and aligned to The Open Group Sensor Open Systems Architecture™. Our Card and Software Packages are Designed for Fast, Portable Integrations. 2 conduction cooled modules. It is designed for use in deployed industrial and military applications in harsh environments. 8 in. AoC3U-1400 Conduction Cooled Chassis with Air Assist VPX VITA 48. The VPX enclosures come in 1U-4U horizontal-mount (for 3U boards, 6U boards, or a mix), 4U-6U vertical-mount (for 3U cards), and 7U, 9U, and higher chassis (for 6U OpenVPX boards). 2 conduction cooled module and supports 6 payload slots and 2 VITA 62 power supplies. A momentary push button is provided for reset, and a switch is. It features a FMC+ slot. Highly versatile and multifunctional, the unit supports a large variety of COTS modules, including: Fully. Embedded RuSH TM technology. 2 RS-232, 2 RS-232/422/485 Chassis Type: Sub-½ ATR Number of Slots: 2 Chassis Cooling: Conduction-Cooled, Natural Convection-Cooled. The chassis is cold plate base coupled conduction cooled. A network-attached Flyable Data Loader (FDL). 88 in. NXP (formerly Freescale) QorIQ T2081, T1042, or T1022 Processor-Based Conduction-Cooled XMC/PrPMC Mezzanine Module. NXP (formerly Freescale) QorIQ T2080 Processor-Based Conduction- or Air-Cooled 3U VPX Single Board Computer (SBC) The XPedite5970 provides a rugged, feature-rich processing solution that maximizes the performance-per-watt capabilities of a Power Architecture®-based processor module. Conforms to VITA 46 VPX specifications. The XPand1201 is a low-cost, flexible, development platform. The DCMs pro-vides RF to IF conversion (where necessary), pre-selection, and gain equalization. Form Factor: 3U VPX. The heat from the internal conduction-cooled modules is conducted to sidewall exchangers, where it is dissipated to the ambient environment by forced-air cooling. However, as module power continues to increase, VITA 48. The conduction-cooled module version of VPX-REDI (Figure 3) can be on either a . It is designed to maintain power to critical systems during short interruptions or voltage fluctuations in the main power source. close. The 7-slot air-cooled Chassis and Backplane incorporates slots for up to four conduction-cooled 3U VPX Payload Boards, plus a 100GbE Switch, SBC, and VITA 62 power supply, delivering up to 700W. [Table 1| These numbers compare cooling capacity using passive, air-assist, and liquid-assist conduction cooling in six-slot VITA 48. The development kit includes the cables needed to connect the XPand6200. It is available in air. We offer air & conduction cooled power supply units for wide range AC as well as DC input. The PCIexpress bus extention kit permits a host CPU to expand its available PCIe slots. Transfer rates up to 3940 MB/s. The removable storage canisters can be optimized for client operations. AoC3U-610 Conduction Cooling with Air Assist. Reconfigurable. Conduction Yes 12 TB 5 GB/s Yes Host Based Yes 7x PCIe Gen3 x4/x8 If used with StoreEngine. 2 * DDR4 banks (up to 4GB each) The IC-FEP-VPX3d is a 3U VPX FPGA processing board based on a Kintex® UltraScale™ FPGA (KU060, KU085 or KU115). Go-No-Go indicators for 12V, 3. pitch without solder-side cover (optional) 1. VMEbus International Trade Association, 2010. The XPand1004 system is a low-cost development platform for conduction-cooled 3U VPX cards. <br /> Wavetherm Corporation. 0 in. WOLF carrier boards are designed to provide system designers with a flexible, highly configurable PCI Express interface. Features include OpenVPX. 0 Ruggedized Enhanced Design Implementation. 2 SSD 1; Up to 64 GB (2x 32 GB) NAND Flash; a straightforward,. Sub-½ ATR, Conduction- or Convection-Cooled Chassis Supporting Conduction-Cooled VPX and XMC or PMC Modules. Power Supplies are available in 3U and 6U, in air- and conduction- cooled form factors >for cPCI, VPX, VME64x & custom applications. 6GHz Thirty-two. Theconduction-cooled VPX load board helps confirm the chassis meets the VITA46/48/65 power specifications for VPX and aids in locating hot spots within theenclosure. VME / VME64x Backplanes Our VME Backplanes are made for industrial applications in different form factors, including vertical and horizontal orientation of the backplane and cards. Backplanes are 100% configurable using Meritec cabling allowing. com Technical Specs Accessories Documentation Block Diagram The XPand1200 is a low-cost, flexible development platform, supporting up to eight 0. 1connectors not included 119EXT6024-06XXR 6U VPX Extender 6U - P0 utility, P1, P3 to P6 differential, P2 single ended 119EXT6024-05XXR 6U VPX Extender 6U - P0 utility, P1 to P6 differentialIt includes the complete connector complement under the standard thus enabling streamlined testing of target payloads. 0 in. 2, 2022 Edition, 2022 - Mechanical Standard for Conduction Cooling VPX. Aisle Containment. OpenVPX now boasts several standards that provide various means of dissipating heat within a system. pitch conduction. 0 in. (604) 875-4405. 3 Up to 24x 10 GETH. PXI Express Chassis Systems. LOWER RISK. Concurrent Technologies. 8 in. 0 VPX: Coaxial Interconnect – Base Standard. The specification of 6U VPX calls for computer cooling via a conduction-cooled envelope compliant with the IEEE standard IEEE-1101. Accommodating cooling methods that include forced air, conduction, and liquid. Accessories. Real-time video feedback for remote platforms ; Unmanned vehicles (UAV, ROV) Real-time IP video distribution. Learn more about this product below »XMC Module | Conduction- or Air-Cooled. The Atom™ E3800 processors provide excellent computational performance and I/O functionality for. Hartmann Electronic VPX Standard Chassis are designed to allow any COTS or customer spec configuration in either 3U or 6U form factor taking into account a wide range of. It is designed to accommodate best-in-class 3U CMOSS and SOSA aligned payloads to meet mission needs with minimal time to theater. DECISIVE PERFORMANCE. Boards are inserted in the back of the chassis in a vertical orientation. View product. VTX989 is a five slot 3U VPX conduction cool chassis; Base plate cooling (cold wall is in the bottom of the chassis) Integrated Power Module within the Chassis; Support for VITA67. It provides 550 W of total simultaneous power, which can be distributed as up to 8 A on 12 V, up to 80 A on 5. Available in fixed or removable configurations, with high performance PCIe/NVMe or low power SATA interfaces, and in air cooled or conduction cooled modules. Related standards not addressed in this paper, and specifying conduction cooled implementations for Eurocard, are VITA 48 describing VPX VITA 46 mechanical implementations and VITA 57 dealing with FMC mezzanines. Our Open Frame systems are available with air cooled or conduction cooled variants and 600W ATX power. Provision is also made for air-cooling via. The XPand1303 is a low-cost, flexible, development platform. The high-performance VX305C-40G is available in both air-cooled (for lab or other benign deployed environments) and conduction-cooled Plug-in units as per VITA 48. 625 IN : Model Number:2. EMG Lab at The Neuromuscular Diseases Unit (NDU) at VGH. Pictured above (from top counter-clockwise) : Acromag VPX4810 PMC/XMC carrier card in air-cooled, conduction-cooled, and VPX-REDI formats. 2 (REDI) )0 inch pitch conduction cooled payload slots in Long format (# of slots in Short format TBD) Configurable rigid front I/O PCBA and 7. They are low-power system-on-chip (SoC. The rugged. 3U CompactPCI 2. LoC3U-510 Extends System Cooling Capacity. The AcroExpress® VPX6860 is a high performance 6U OpenVPX™ single board computer based on the 6th Generation Intel® Xeon® E processor (formerly Skylake) and PCH. Controlled impedance rigid-flex-rigid design. 6 Gigabit Ethernet Control Plane on VPX VITA 46. 0 in. AoC3U-410 Conduction Cooling with Air Assist. 2-7. 3U VPX with NVIDIA Jetson AGX Xavier Industrial and ConnectX-6, SOSA aligned Payload profile module for HPC tasks such as sensor data processing, machine vision, and other C4ISR tasks. Block Diagram. It defines a keying system that can be added to VME64x boards and backplanes in a conduction cooled environment (IEEE 1101. This platform supports up to eight 0. 52 in. The XChange3000 is a 3U VPX-REDI module supporting a single-width XMC or PrPMC card. The standard configuration includes two 10/100/1000BASE-T Ethernet ports, seven. The up to 800 Watt power output true 6. VPX MEDIA CONVERTER MODULE SUMMARY CF-020010-57X 57X Block Diagram VITA 48. The Chassis Manager is VITA 46. View. These rugged power supplies are available in 200W-1300W power configurations. This Standard defines the mechanical requirements that are needed to ensure the mechanical interchangeability of conduction cooled 3U and 6U Plug-In Modules and defines the features required to achieve Two. VITA 46. It supports up to two 0. 3V, 5V, +12V_Aux,ANSI/VITA 48. PCI Systems, a supplier of conduction cooled systems, has announced a 3U VPX Gen3 8x Lane PCIe to VPX adapter. 0 in. Up to 32GB DDR4 ECC RAM. Acromag’s XMC-7K modules feature a high-performance user-configurable Xilinx® Kintex®-7 FPGA enhanced with high-speed memory and a high-throughput serial bus interface. Block Diagram. NXP (formerly Freescale) QorIQ P2020 Dual-Core Processor-Based Conduction- or Air-Cooled 3U VPX-REDI Single Board Computer. Keying for Conduction Cooled VME64x: This standard is an extension of the VME64x Standard, ANSI/VITA 1. Serial I/O. Conduction-cooled modules include an additional 10/100Base-TX port available on the rear VPX connector. All offers are typically available for. Products. 125 Gb/sec. The ICE-Lok® thermally enhanced Wedge. Since heat energy wants to move from. Small and extremely rugged, cold plate base coupled, conduction cooled enclosure measures 9″L x 6″W x 7. Embedded RuSH technology actively monitors voltage, current and temperature and talks over system management bus using I2C. available in air cooled or conduction cooled with thermally efficient heatsink technology and rear I/O. Convection and Conduction cooled ATR (Air Transport Rack) enclosures offer a standardized, cost effective solution for PCI, VME, VME64x, VXS, cPCI and VPX based applications. Tested to MIL-STD-810, VITA47. 6U/ 5HP VPX load card, conduction cooled. 8x D1 Video Frame Grabber 3U VPX card. The XPand1508 supports two standard VITA 46. Usually the test adapter includes fields for voltage and amp, current measurements and in some cases also some pins for wire wrap to conduct custom. VPX is a broadly defined technology utilizing the latest in a variety of switch fabric technologies in 3U and 6U format blades. The DK3 / DK6 for 3U and 6U VPX system design, support air and conduction cooled modules with quick conversion that tracks and streamlines your. 6U VPX boards and utilizes RTMs to simplify I/O access and support rapid system prototyping. Elma Electronic’s NetKit-3110 is a rugged, conduction-cooled router based on the Cisco ESR6300. The newly ratified ANSI/VITA 48. Verifies chassis can meet power requirement and specifications for VPX. PXI / PXIe Chassis. 8 in. 11 & VITA 62. LXH0000840; Request a Quote. Form Factor: 3U VPX Ethernet: 4 10/100/1000BASE-T USB: 2 USB 2. 2 conduction cooled 6U VPX module with 1 inch pitch : • 6Ux160mm form factor as defined by IEEE 1101. This system supports standard SBC and switch modules, as well as VITA 67 modules, making it the ideal platform for high-performance RF applications. -No. This standard defines the mechanical requirements that are needed to ensure the mechanical interchangeability of conduction cooled 3U and 6U Plug-In Modules and defines the features required to achieve Two Level Maintenance compatibility. With multiple high-speed fabric interfaces, x8 PCI Express Gen3, 12 high-speed fiber-optic transceivers, and 8 GB of DDR4-2400 SDRAM in two channels, the. View. OC-CC-VPX-3U-5HP-SS-300-LB48 WT ASSY # - 43094 3U VITA 48. 8”. Ports: OpenVPX 3U Switch slot profile: SLT3-SWH-2F24U-14. 1/2 ATR, conduction-convection cooled. XIt1085 (90040045) - 3U VPX Rear Transition Module with Gigabit Ethernet, SATA, USB, Serial, and DisplayPort XPand1004 (90071810) - Two-Slot 3U VPX Development Platform for Conduction-Cooled Modules with RTM I/O XPand1200 (90070530) - 3U VPX Development Platform for Up to Eight Conduction-Cooled. Part of our AoC3U-800 Series of rugged packaging solutions, the AoC3U-821 enables high slot count systems in a precision engineered chassis for 3U VPX and SOSA aligned plug in card payloads. Designed to meet the requirements of VITA 62 for use in harsh environments. It features a FMC+ slot. The liquid-cooled chassis sidewalls will. 2 coaxial/RF for four of the slots (defaultbackplane routing) All I/O are thru the front of the chassis; 250W integrated. The DK3 / DK6 for 3U and 6U VPX system design, support air and conduction cooled modules with quick conversion that tracks and streamlines your development cycle. The new cooling standard defines design requirements for platforms that need high performance processing, graphics. The RFDC is a 1 inch pitch, conduction cooled, VPX circuit card assembly per VITA 48. Products. 2 / VPX conduction cooled thermal load board module. 8-2017, “Mechanical Standard for Electronic VPX Plug-in Modules Using Air Flow Through Cooling,” is a bit long-winded, but it’s essentially an air-cooled standard. (L) x 4. Intel® Xeon® D-1500 Processor-Based Rugged Small Form Factor (SFF) COTS System with Xilinx Kintex® Ultrascale™ FPGA. 2 conduction cooled modules because of their established deployment track record. comThe VTX994 is a single slot 6U VPX chassis for board bring-up and testing of conduction cooled 6U VPX modules. It provides 550 W of total simultaneous power, which can be distributed as up to 50 A on 12 V, up to 50 A on 5 V, and up to 80 A on 3. Max 10. Curtiss Wright. 1. 8” Pitch (Conduction Cooled) VPX & PCIe Graphics Processor Operating Temperature (MIL-STD-810) NVIDIA Quadro RTX 3000 GPU (TU106 Turing Architecture) -40°C to 70°C (Rugged Air Cooled) Supporting DirectX 12, OpenGL 4. 3U VPX, 6U VPX, and OpenVPX-based SBCs, I/O, storage, switches, rugged systems, and development platforms featuring Intel Core i7, Intel Xeon D, & Freescale QorIQ T-Series and P-Series processor technology. View product Compare. VPX Backplane, 3 U, 5 Slots, Full-Mesh, Without RTM. 1, titled “VPX Conduction Cooling: Frame Construction,” extends the VITA 48. The VX305H-40G is also available with. VENRAY, the Netherlands July 21st 2010 - VSN Systemen bv, a leading telecom hardware and software developer, launches OpenTSP NG technical building blocks,which are essential for the development of the newest multimedia applications. The heat from the internal conduction-cooled modules is conducted to sidewall heat exchangers, where it is dissipated to the ambient environment by convection cooling or to an attached cold plate by conduction cooling. VITA 62 Compliant 3U VPX power supply. 1 switch and 10G backplane Ethernet switch in a single 3U module, enabling you to connect between a wide range of module types – including those with earlier Gen 1 or Gen 2 PCIe interfaces. 2 applies to 3U and 6U VPX embedded computing modules, and defines the dimensions of plug-in units for conduction-cooled applications and connector-mounting details, as well as key sub. The PCIe and Gigabit Ethernet fabrics provide switching for a star topology. 4mm; Weight: To be Announced;Sub-½ ATR, Conduction- or Convection-Cooled Chassis Supporting Conduction-Cooled VPX and XMC or PMC Modules. 3VIO, Short tail connectors on J1, long tail connectors on J2. AoC3U-210: air over conduction cooled 2 slot 3U VPX ATR chassis for 3U VPX and SOSA aligned plug in card payloads. 3 to the P15 connector for interfacing with the host module. 8 in. 6U VPX Load Board Forced Air-Cooled Enclosure Two-Slot OpenVPX Development Platform IPv4/IPv6 Gigabit Ethernet Switch 4 0 On the Cover. 877-214-6267 salesacromag. Development chassis for VPX and SOSA aligned module payloads. 3 V. With multiple high-speed fabric interfaces, external memory, Xilinx Virtex-7 FPGA, an FMC site, and high-density I/O, the XPedite2470 is ideal for customizable, high-bandwidth, signal. Mechanical Specifications for Microcomputers Using REDI Conduction Cooling Applied to VITA VPX: This standard defines the mechanical requirements that are needed to ensure the mechanical interchangeability of conduction cooled 3U and 6U Plug-In Modules and defines the features required to achieve Two Level Maintenance compatibility. They can be used to power a VPX chassis and will fit into the standard envelope defined by. VStream-VPX Datasheet Order Enquiry for VStream-VPX. 2 mechanicalformat. 8 in. 59"L x 4. Both are designed to support a minimum of ten 0. Our AoC chassis are designed for mission critical defense applications in the most extreme. 11 monitoring and control Input voltage reverse‑polarity protection Remote voltage sensing for +12V and +3. 3V_Aux. 1, titled “VPX Conduction Cooling: Frame Construction,” extends the VITA 48. Dawn’s VPX backplanes support development systems, deployable rack mount and mission critical systems for convection and conduction cooled modules. This emerging family of ATR chassis is designed to maintain safe operating temperatures for. 3U Open VPX power supply Conduction cooled I 2 C IPMI 46. Graphics Processing Units (GPUs) LCR Embedded Systems’ fully integrated, conduction-cooled, featherweight 2-Slot VPX System (shown at right) will break new ground in addressing the concerns of UAV application developers and allow for the massive expansion of payload performance and processing power for autonomous vehicles. Intel® Xeon® D-1700 Processor-Based 3U VPX-REDI Module with 48 GB of DDR4, 40 Gigabit Ethernet, and SecureCOTS™. Conduction-Cooled Assemblies (CCA) adaptor (EuropacPRO/-rugged, VPX/CompactPCI) *The price shown is the per piece price and does not include VAT. Data Plane. FPGA Family. VP32004 - LinkedHope Intelligent Technologies Co. 3U VPX (OpenVPX Compliant) Environmental Specifications Temperature Limits. PWB area and improved thermal management (air-cooled, conduc-tion-cooled, liquid flow-through cooling), enabling increased func-tional density and providing support for use as an LRM. 3 slot apertures for a variety of RF and optical I/O connectors targeting a range of applications. Output over-voltage, over-current, and over-temperature. . ½ ATR-compliant, natural convection-cooled or conduction-cooled chassis (reduced height and length) Dimensions: 10. Related Products. Item/Part Number: 1940000446-0000R Product Features Load board for VPX systems, meets ANSI/VITA mechanical and electrical connection standards Verifies chassis can meet power requirement and. 8 in. 2 specification. 2 Type 2, Secondary Side Retainer. Higher conduction means lower component temperatures . Part of our 1400 Series of conduction cooled enclosures with air assist, the 1440 is designed to maintain safe operating temperatures for high slot count 3U VPX systems and may be used as a deployment or development chassis. 5” front panel with Hercules ® high-speed, ruggedized, circular mil connectors allows customization to exact application requirements. 2 Type 2, Secondary Side Retainer. The DK3 for 3U VPX features an open frame concept and enhanced flexibility, with fast conversion between air and conduction cooled module guides.